China's domestic Wi‑Fi chip industry entered a rapid growth phase in 2026, with large‑scale shipments and earnings releases across Wi‑Fi MCUs, main chips, and RF front‑end FEMs. AIoT, smart home, and industrial IoT demand is pushing Wi‑Fi chips from basic connectivity toward connectivity + compute + edge intelligence.
Espressif (乐鑫科技): H1 revenue RMB 1.481B (+18.88% YoY); net profit RMB 334M (+27.93%). Q2 revenue hit a record RMB 833M; gross margin rose to 49.32% (+4.12 pts). The ESP32‑S31 (dual‑core RISC‑V, SIMD, multi‑protocol) entered mass production in July. The ESP32‑E22 received Wi‑Fi CERTIFIED 6E (tri‑band, 2×2 MU‑MIMO, 160MHz). Wi‑Fi 7 products targeted for mid‑2027.
Beken (博通集成): H1 revenue RMB 639M (+70.21%); net profit RMB 50.5M (+162.60%). Wi‑Fi 6 MCUs (BK7236/7238/7258) are in volume supply for smart home and AIoT; next‑gen edge AI chips (BK7259/7239N/7236N) are ramping.
Kangxi Communication (康希通信): H1 revenue RMB 395M (+20.58%); net profit RMB 27.5M (swung from loss). Wi‑Fi FEM shipments rose, driven by Wi‑Fi 7 ramp. Full Wi‑Fi 5/6/7 FEM portfolios are certified by Broadcom, Qualcomm, and MediaTek. Wi‑Fi 8 integrated FEMs are in development.
Amlogic (晶晨股份): H1 revenue RMB 4.391B (+31.85%); net profit RMB 611M (+22.99%). Q2 revenue RMB 2.496B (+38.59% YoY, +31.66% QoQ). TV SoC share gains and premium product adoption drove growth. Wi‑Fi 6 chip shipments exceeded 7M units in 2025, targeting >10M in 2026. The 6nm edge AI platform A311Y3 launched in Q2.
Telink (泰凌微): H1 revenue RMB 541M (+7.37%); net profit RMB 98.7M (‑2.31%). Q2 net profit RMB 90.5M (+38.4% YoY). R&D rose 38.85% to RMB 162M. The TLSR9118 supports Matter over Wi‑Fi; multi‑protocol Wi‑Fi 6 + BLE/Zigbee/Thread/Matter chips and modules are in development.
Other players: Wuqi Microelectronics launched a RISC‑V Wi‑Fi 6 AP chip (3Gbps), shipping to ZTE Micro and Changhong; its STAR Market IPO was accepted in June 2026. Sudong Semiconductor's Wi‑Fi 6/6E AP chipsets reach 3000Mbps. Aike Micro's automotive‑grade Wi‑Fi 6 chips supply Dongfeng, FAW, and Chery; its IPO coaching entered acceptance in September.
Market size: Wi‑Fi 6/6E chipset market was ~$39.03B in 2024**, forecast to reach **$107.4B by 2033. Global Wi‑Fi chipset market is ~$21–24B in 2025, with mid‑single‑digit CAGR through 2034; China's domestic market is expected to grow >11% annually from 2026–2030.
ICgoodFind Takeaway:
Chinese Wi‑Fi chipmakers are delivering on years of R&D – Wi‑Fi 6 is scaling, Wi‑Fi 7 is ramping, and Wi‑Fi 8 is already in development. With full‑chain coverage from MCU to FEM, domestic substitution is accelerating.
