Global NOR Flash Chips Manufacturers Summary

Release date:2025-12-08 Number of clicks:126

Winbond Electronics (WINBOND): Global NOR Flash Leader

  • Overview: Founded in September 1987 and listed on the Taiwan Stock Exchange in 1995, Winbond is headquartered in the Central Science Park, Taiwan.
  • NOR Flash: Holds a 27% global market share, ranking first for many consecutive years. It targets the low-to-medium density market (512Kb–2Gb) and has advanced its process technology to 45nm.
    • Key Models: W25Q128JV (128Mb, Industrial Wide Temp), W25Q256JV (256Mb, Quad SPI), W25Q80DVSNIG (8Mb, Consumer Grade).
    • Applications: Widely used in IoT modules and smart home devices.
  • Customized Memory (CMS): The world's 5th largest DRAM supplier, focusing on small-to-medium capacities and special applications. 20nm process is in mass production, with plans to upgrade to 16nm.
  • SPI NAND Flash: Holds 13% market share (Global No. 3), focusing on wearables.
    • Key Models: W25N01GV (1Gb, Low Power), W25N02KV (2Gb, High Reliability).
    • Applications: TWS earbuds and smart bands.

Macronix (MXIC): NOR Flash Pioneer

  • Overview: Established in Hsinchu, Taiwan, in 1989 and listed in 1995. It operates one 12-inch and one 8-inch wafer fabrication plant.
  • NOR Flash: In 2024, NOR Flash accounted for 59% of its total revenue.
    • Technology: Mass production of 45nm 1.8V products (e.g., MX25L12835F) and sampling of 55nm 1.2V products (e.g., MX25L25635F), both supporting wide temperature ranges (-40°C to 125°C).
    • Applications: Core models serve automotive and industrial sectors; consumer-grade models (e.g., MX25U6435F) target wearables.
  • Other Segments:
    • ROM: 22% of revenue.
    • NAND Flash: 11% of revenue. 96-layer 3D NAND entered stable production in 2023, with future plans for enterprise SSDs.

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GigaDevice (兆易创新): China's NOR Flash Leader, Global No. 2

  • NOR Flash: Ranks second globally and first in mainland China. Capacity range: 512Kb to 2Gb.
    • Key Models: GD25Q128E (128Mb, AEC-Q100 certified), GD25Q256E (256Mb, 400MB/s high speed), GD25WD64E (64Mb, 1.2V low power).
    • Clients: Supplies automakers like Tesla and BYD, as well as consumer electronics manufacturers.
  • SLC NAND Flash: Ranked 6th globally and 1st in mainland China (2024).
    • Key Models: GD5F1GQ4UAYIG (1Gb), GD5F2GQ4UAYIG (2Gb).
    • Applications: Smart speakers and dashcams.
  • DRAM: Ranked 7th globally and 2nd in mainland China (2024). Product lines include DDR4, DDR3L, and LPDDR4.

Puyang Semiconductor (普冉半导体)

  • NOR Flash: Utilizes SONOS and ETOX process structures. Capacity range: 512Kbit to 1Gbit.
    • Key Models: P25Q80H (8Mb, SONOS), P25Q64H (64Mb, 55nm), P25Q128H (128Mb, Industrial Grade). 40nm系列产品 are widely used in TWS earbuds.
  • EEPROM: Capacity range: 2Kbit to 4Mbit.
    • Key Models: P24C02C (2Kbit, Consumer), P24C16C (16Kbit, Industrial).
    • Process: Primarily 130nm, with some products using 95nm or below.

East Memory (东芯半导体)

  • NOR Flash: Based on 48nm/55nm processes. Capacity range: 64Mb to 2Gb.
    • Key Models: AX25L12835F (128Mb, Wide Temp), AX25L25635F (256Mb, High Speed SPI).
    • Applications: Industrial control modules.
  • SLC NAND Flash: Iterating on 2xnm products; 1xnm products are in risk production.
    • Key Model: AX58F1G1635F (1Gb).
  • DRAM & MCP: Mass production of DDR3L and LPDDR4X. Offers MCP combinations (e.g., 4Gb+4Gb) for 5G and automotive modules.

XTX Technology (芯天下): Innovative NOR Flash Vendor

  • Overview: Founded in 2014 and headquartered in Shenzhen. It is a national "Little Giant" specializing in storage chips.
  • NOR Flash: Focuses on the NORD technology. Capacity range: 1Mbit to 128Mbit (expandable to 2Gb via co-fabrication).
    • Features: Advanced 50nm/55nm process, wide voltage (1.65V~3.6V), ultra-low power consumption (sleep current as low as 0.3μA).
    • Key Models:
      • Small Capacity: XTD25W02A (2Mbit), suitable for IoT sensors.
      • Medium Capacity: XTD25W08A (8Mbit), supports Quad I/O (456Mbit/s).
  • Other Segments: Expanding into SLC NAND, MCU, and PMIC for a diversified ecosystem.

Fudan Microelectronics (复旦微电子)

  • NOR Flash: Part of the FM25/FM29 series. Supports SPI and parallel interfaces. Capacity range: 0.5Mb to 2Gb.
    • Key Models: FM25V10 (1Mb), FM29F1G08AB (1Gb).
    • Applications: Industrial control boards.
  • SLC NAND Flash: Capacity range: 1Gb to 8Gb.
  • EEPROM: Part of FM24/FM25/FM93 series. Capacity range: 1Kbit to 2Mbit.

Joint Technology (聚辰股份)

  • NOR Flash: Based on NORD process. Capacity range: 512Kb to 128Mb.
    • Key Models: GT25Q32 (32Mb, Automotive Grade), GT25Q64 (64Mb).
    • Certification: 512Kb-8Mb products passed AEC-Q100 Grade 1.
  • EEPROM: Ranked 3rd globally (~15.9% market share) and 1st in China. Offers both industrial and automotive-grade EEPROM. Capacity range: 1Kb to 2Mb.

Hotifu (恒烁半导体)

  • NOR Flash: Based on ETOX process (using foundries like XMC). Capacity range: 1Mbit to 512Mbit.
    • Key Models: HS25D128G (128Mb), HS25Q256G (256Mb).
    • Applications: Smart locks and security cameras.
  • NAND Flash: Uses 24nm wafers. Offers SPI NAND, SD NAND, and PPI NAND with strong ECC capabilities.
  • DRAM: DDR4 products (4Gb, 8Gb) are scheduled for mass production in the first half of 2025.

XMC (武汉新芯)

  • Overview: Established in 2006, it is China's leading 12-inch specialty process foundry.
  • NOR Flash: The largest NOR Flash manufacturer in China. Mastering both floating gate (50-65nm) and charge trapping technologies.

International Giants (Strategic Shifts)

Samsung

  • Status: Exited the general-purpose NOR Flash market.
  • Details: In 2024, Samsung redirected mature capacity to higher-profit HBM and DDR5 production. While it previously offered models like KM4216C258G, its core focus is now on NAND Flash (~35.2% global share) and DRAM.

SK Hynix

  • Status: Exited the NOR Flash business.
  • Details: In Q3 2025, SK Hynix sold all shares of the joint venture SkyHigh Memory (SHM), which was formed with Cypress. The company now focuses entirely on DRAM and advanced NAND Flash (321-layer technology).

Micron

  • Status: Reduced general market presence but maintains a strong position in Automotive.
  • Key Models: MT25QL128ABA1ESE (128Mb, AEC-Q100 Grade 2), MT25QL256ABA1ESE (256Mb, 40nm).
  • Applications: High-end automotive electronics and industrial control.

Infineon (Cypress)

  • Status: A former global leader, now focused on Automotive and IoT after acquisition.
  • Key Models: S25FL256S (256Mb, Low Power), S25FL128S (128Mb, Industrial).
  • Applications: High market share in infotainment and industrial IoT.

Other Notable Vendors

  • Biwin (佰维存储): Global supplier for consumer and industrial grades. Key models: BW25Q128JVSIQ. Offers full-chain capabilities.
  • Fidelix : Korean vendor focusing on small capacities. Key models: FX25L1606E. Clients include Samsung and LG.
  • ICgoodFind Perspective: As a procurement platform, ICgoodFind notes that the current market is led by Winbond (W25Q), Macronix (MX25), and GigaDevice (GD25). Following the exit of Samsung and SK Hynix, local vendors like XTX (XTD25 series) are rapidly rising. The platform provides comprehensive solutions for these needs.

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